Introducing the Lead Free Reflow Oven: Your key to high-volume manufacturing success! With 8 heated zones and 2 chilled air cooling zones, it guarantees top-notch quality while achieving outstanding ΔT values across the PCB ensuring your production runs smoothly without compromising on reliability.

Features

  • Independent heated zones for precise soldering with hot air or nitrogen atmosphere.
  • Efficient cooling with chilled air cooling zones for rapid board cooling.
  • Versatile board handling with adjustable heated length and board width options.
  • Reliable conveyor system with adjustable speed for smooth PCB transportation.

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